Ultrasonic Microscope 'SAM'
Non-destructive observation is possible! It is effective in detecting defects in internal conditions and adhesion states!
We would like to introduce our ultrasonic microscope, the SAM (Scanning Acoustic Microscope). It is highly effective in detecting defects in the internal conditions and adhesion states of semiconductor packages, substrates, and electronic components. Observation can be performed non-destructively, and defects such as delamination can be detected from the reflected waves of the ultrasonic waves incident on the sample. 【Specifications (excerpt)】 ■ Pulse Receiver: 500MHz ■ Observation Methods: Compatible with both reflection and transmission methods ■ Acoustic Lenses / Reflection Method: 15, 25, 30, 50, 80, 100, 230MHz ■ Acoustic Lenses / Transmission Method: 15, 25, 30, 50, 100MHz *For more details, please refer to the PDF document or feel free to contact us.
- Company：アイテス
- Price：Other
![[C-SAM] Ultrasonic Microscopy Method](https://image.mono.ipros.com/public/product/image/dda/2000387315/IPROS30609954037734018246.jpeg?w=280&h=280)
