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Ultrasonic microscope Product List

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Ultrasonic Microscope 'SAM'

Ultrasonic Microscope 'SAM'

Non-destructive observation is possible! It is effective in detecting defects in internal conditions and adhesion states!

We would like to introduce our ultrasonic microscope, the SAM (Scanning Acoustic Microscope). It is highly effective in detecting defects in the internal conditions and adhesion states of semiconductor packages, substrates, and electronic components. Observation can be performed non-destructively, and defects such as delamination can be detected from the reflected waves of the ultrasonic waves incident on the sample. 【Specifications (excerpt)】 ■ Pulse Receiver: 500MHz ■ Observation Methods: Compatible with both reflection and transmission methods ■ Acoustic Lenses / Reflection Method: 15, 25, 30, 50, 80, 100, 230MHz ■ Acoustic Lenses / Transmission Method: 15, 25, 30, 50, 100MHz *For more details, please refer to the PDF document or feel free to contact us.

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Ultrasonic microscope observation of semiconductor packages

Ultrasonic microscope observation of semiconductor packages

Ultrasonic microscope observation of transistors! It is possible to check the peeling conditions at various locations even with the same focus.

We would like to introduce our ultrasonic microscope observation of semiconductor packages. Due to storage conditions and mounting conditions, delamination can occur between the metal parts (die pad) and the package resin in semiconductor packages. Delamination inside the package is a defect that significantly affects product quality, but it cannot be confirmed visually from the outside. By using an ultrasonic microscope, we can clearly capture the internal structure of the package and contribute to reliability evaluation. 【Features】 ■ Ultrasonic microscope observation from the chip side - By changing the focal position, previously unseen areas of the same sample become visible. ■ Ultrasonic microscope observation from the die pad side - Delamination conditions can be confirmed at various locations even with the same focus. *For more details, please download the PDF or feel free to contact us.

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  • Ultrasonic microscope

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[C-SAM] Ultrasonic Microscopy Method

[C-SAM] Ultrasonic Microscopy Method

C-SAM is a non-destructive method for observing defects such as delamination within a sample.

C-SAM is also known as SAT: Scanning Acoustic Tomography. - It is effective for confirming the "bonding state of electrodes" and "adhesion of bonded wafers," which are difficult to verify with X-ray CT observations. - In addition to reflected waves, transmission waves can also be acquired.

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  • Contract Analysis
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  • Circuit board design and manufacturing
  • Ultrasonic microscope

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[Analysis Case Study] Observation of Adhesion State Through Metal Plates Using Ultrasonic Microscopy

[Analysis Case Study] Observation of Adhesion State Through Metal Plates Using Ultrasonic Microscopy

If it is something that ultrasonic waves can penetrate, you can check internal information that cannot be confirmed from the appearance!

Here is a case study of observing the adhesive state through a metal plate using an ultrasonic microscope. The ultrasonic microscope can confirm internal information that cannot be seen from the exterior, as long as the ultrasonic waves can penetrate. After reliability testing, we observed the condition of the adhesive remaining on the metal plate from the metal side in a sample where the chip had come off. Please refer to the PDF document for details on the observations and results. [Case Overview] - Observation of the adhesive layer between the metal and the chip - Observation of the adhesion state between the metal and the adhesive *For more details, please download the PDF or feel free to contact us.

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  • Ultrasonic microscope

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